Re: what's next for the linux kernel?

[Bill Davidsen]

Lennart Sorensen wrote:
> On Tue, Oct 04, 2005 at 01:53:54PM +0100, Luke Kenneth Casson Leighton wrote:

> > at 45nm the current leakage is so insane that the heat
> > dissipation, through the oxide layer which covers the chip,
> > ends up blowing the chip up.
>
>
> Unless someone finds a way to reduce the leakage.  It is worth a lot of
> money to some companies to solve that problem after all.

That's one way, the other is to find a way to cool such a chip. I see 
references to diamond substrate from time to time, good thermal 
conductor. So are other carbon forms, Fullerines, etc.

Clearly reducing leakage is the optimal solution, "deal with the heat" 
is the other.
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