Re: [PATCH V10 3/7] interconnect: qcom: Add multidev EPSS L3 support

From: Georgi Djakov
Date: Mon Apr 14 2025 - 05:58:18 EST


On 24.03.25 20:31, Raviteja Laggyshetty wrote:
EPSS on SA8775P has two instances, necessitating the creation of two
device nodes with different compatibles due to the unique ICC node ID
and name limitations in the interconnect framework. Add multidevice
support for the OSM-L3 provider to dynamically obtain unique node IDs
and register with the framework.
EPSS topology includes a single master-slave pair within the same
provider, the node linking logic is simplified by directly connecting
the master node to the slave node.

Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@xxxxxxxxxxx>
---
drivers/interconnect/qcom/osm-l3.c | 36 ++++++++++--------------------
1 file changed, 12 insertions(+), 24 deletions(-)

diff --git a/drivers/interconnect/qcom/osm-l3.c b/drivers/interconnect/qcom/osm-l3.c
index 6a656ed44d49..43e67d2116b9 100644
--- a/drivers/interconnect/qcom/osm-l3.c
+++ b/drivers/interconnect/qcom/osm-l3.c
@@ -1,6 +1,7 @@
// SPDX-License-Identifier: GPL-2.0
/*
* Copyright (c) 2020-2021, The Linux Foundation. All rights reserved.
+ * Copyright (c) 2025 Qualcomm Innovation Center, Inc. All rights reserved.
*/
#include <linux/args.h>
@@ -48,16 +49,10 @@ struct qcom_osm_l3_icc_provider {
/**
* struct qcom_osm_l3_node - Qualcomm specific interconnect nodes
* @name: the node name used in debugfs
- * @links: an array of nodes where we can go next while traversing
- * @id: a unique node identifier
- * @num_links: the total number of @links
* @buswidth: width of the interconnect between a node and the bus
*/
struct qcom_osm_l3_node {
const char *name;
- u16 links[OSM_L3_MAX_LINKS];

Please remove also the #define for OSM_L3_MAX_LINKS, as it's unused now.

- u16 id;
- u16 num_links;
u16 buswidth;
};


BR,
Georgi