[PATCH 2/4] thermal: qcom: Add Kconfig entry & compilation support for qmi cooling driver

[Bhupesh Sharma]

Add Kconfig entry & compilation support for Qualcomm qmi cooling driver.

Cc: daniel.lezcano@xxxxxxxxxx
Cc: rafael@xxxxxxxxxx
Cc: andersson@xxxxxxxxxx
Signed-off-by: Bhupesh Sharma <bhupesh.sharma@xxxxxxxxxx>
---
 drivers/thermal/qcom/Kconfig              |  4 ++++
 drivers/thermal/qcom/Makefile             |  2 ++
 drivers/thermal/qcom/qmi_cooling/Kconfig  | 14 ++++++++++++++
 drivers/thermal/qcom/qmi_cooling/Makefile |  3 +++
 4 files changed, 23 insertions(+)
 create mode 100644 drivers/thermal/qcom/qmi_cooling/Kconfig
 create mode 100644 drivers/thermal/qcom/qmi_cooling/Makefile

diff --git a/drivers/thermal/qcom/Kconfig b/drivers/thermal/qcom/Kconfig
index ccfd090273c1..d383b2cf4c7f 100644
--- a/drivers/thermal/qcom/Kconfig
+++ b/drivers/thermal/qcom/Kconfig
@@ -53,3 +53,7 @@ config QCOM_LMH
 	  input from temperature and current sensors.  On many newer Qualcomm SoCs
 	  LMh is configured in the firmware and this feature need not be enabled.
 	  However, on certain SoCs like sdm845 LMh has to be configured from kernel.
+
+menu "Qualcomm QMI cooling drivers"
+source "drivers/thermal/qcom/qmi_cooling/Kconfig"
+endmenu
diff --git a/drivers/thermal/qcom/Makefile b/drivers/thermal/qcom/Makefile
index 0fa2512042e7..61114129827a 100644
--- a/drivers/thermal/qcom/Makefile
+++ b/drivers/thermal/qcom/Makefile
@@ -1,4 +1,6 @@
 # SPDX-License-Identifier: GPL-2.0-only
+obj-$(CONFIG_QCOM_QMI_COOLING)	+= qmi_cooling/
+
 obj-$(CONFIG_QCOM_TSENS)	+= qcom_tsens.o
 
 qcom_tsens-y			+= tsens.o tsens-v2.o tsens-v1.o tsens-v0_1.o \
diff --git a/drivers/thermal/qcom/qmi_cooling/Kconfig b/drivers/thermal/qcom/qmi_cooling/Kconfig
new file mode 100644
index 000000000000..96488181cd5f
--- /dev/null
+++ b/drivers/thermal/qcom/qmi_cooling/Kconfig
@@ -0,0 +1,14 @@
+# SPDX-License-Identifier: GPL-2.0-only
+
+config QCOM_QMI_COOLING
+	tristate "Qualcomm QMI cooling drivers"
+	depends on QCOM_RPROC_COMMON
+	depends on ARCH_QCOM || COMPILE_TEST
+	select QCOM_QMI_HELPERS
+	help
+	   This enables the remote subsystem cooling devices. These cooling
+	   devices will be used by Qualcomm chipset to place various remote
+	   subsystem mitigations like remote processor passive mitigation,
+	   remote subsystem voltage restriction at low temperatures etc.
+	   The QMI cooling device will interface with remote subsystem
+	   using Qualcomm remoteproc interface.
diff --git a/drivers/thermal/qcom/qmi_cooling/Makefile b/drivers/thermal/qcom/qmi_cooling/Makefile
new file mode 100644
index 000000000000..ea6cb3c8adb0
--- /dev/null
+++ b/drivers/thermal/qcom/qmi_cooling/Makefile
@@ -0,0 +1,3 @@
+# SPDX-License-Identifier: GPL-2.0-only
+obj-$(CONFIG_QCOM_QMI_COOLING)	+= qcom_cooling.o
+qcom_cooling-y			+= qcom_tmd_services.o qcom_qmi_cooling.o
-- 
2.37.1