Re: [PATCH v4 5/8] ARM: dts: Add properties to use pwm-fan device as a cooling device in Odroid U3

From: Eduardo Valentin
Date: Wed Feb 25 2015 - 13:30:48 EST


On Wed, Feb 25, 2015 at 02:28:15PM +0100, Lukasz Majewski wrote:
> Hi Eduardo,
>
> > On Wed, Feb 18, 2015 at 11:07:33AM +0100, Lukasz Majewski wrote:
> > > With those bindings it is possible to use pwm-fan device available
> > > in Odroid U3 as a cooling device.
> > >
> > > Signed-off-by: Lukasz Majewski <l.majewski@xxxxxxxxxxx>
> > > ---
> > > Changes for v2:
> > > - Rename cooling-pwm-values property to cooling-levels
> > > Changes for v3:
> > > - Change patch's topic to "ARM dts"
> > > - Reduce maximal cooling-level to 230 from 255
> > > Changes for v4:
> > > - None
> > > ---
> > > arch/arm/boot/dts/exynos4412-odroidu3.dts | 33
> > > ++++++++++++++++++++++++++++++- 1 file changed, 32 insertions(+), 1
> > > deletion(-)
> > >
> > > diff --git a/arch/arm/boot/dts/exynos4412-odroidu3.dts
> > > b/arch/arm/boot/dts/exynos4412-odroidu3.dts index 60bd1e4..3e5df3e
> > > 100644 --- a/arch/arm/boot/dts/exynos4412-odroidu3.dts
> > > +++ b/arch/arm/boot/dts/exynos4412-odroidu3.dts
> > > @@ -32,11 +32,42 @@
> > > };
> > > };
> > >
> > > - pwm-fan {
> > > + fan0: pwm-fan {
> > > compatible = "pwm-fan";
> > > pwms = <&pwm 0 10000 0>;
> > > + cooling-min-state = <0>;
> > > + cooling-max-state = <3>;
> > > + #cooling-cells = <2>;
> > > + cooling-levels = <0 102 170 230>;
> > > status = "okay";
> > > };
> > > +
> > > + thermal-zones {
> > > + cpu_thermal: cpu-thermal {
> >
> >
> > This thermal zone misses the mandatory properties as per
> > Documentation/devicetree/bindings/thermal/thermal.txt
>
> Following mandatory properties:
> thermal-sensors = <&tmu 0>;
> polling-delay-passive = <0>;
> polling-delay = <0>;
> trips {
>
> }
>
> are defined in exynos4-cpu-thermal.dtsi included by this file.
>
> In this patch only device dependent changes are stated.

OK. I missed that.



>
> >
> > > + cooling-maps {
> > > + map0 {
> > > + trip = <&cpu_alert1>;
> > > + cooling-device = <&cpu0 7 7>;
> > > + };
> > > + map1 {
> > > + trip = <&cpu_alert2>;
> > > + cooling-device = <&cpu0 13
> > > 13>;
> > > + };
> > > + map2 {
> > > + trip = <&cpu_alert0>;
> > > + cooling-device = <&fan0 0 1>;
> > > + };
> > > + map3 {
> > > + trip = <&cpu_alert1>;
> > > + cooling-device = <&fan0 1 2>;
> > > + };
> > > + map4 {
> > > + trip = <&cpu_alert2>;
> > > + cooling-device = <&fan0 2 3>;
> > > + };
> > > + };
> > > + };
> > > + };
> > > };
> > >
> > > &pwm {
> > > --
> > > 2.0.0.rc2
> > >
>
>
>
> --
> Best regards,
>
> Lukasz Majewski
>
> Samsung R&D Institute Poland (SRPOL) | Linux Platform Group

Attachment: signature.asc
Description: Digital signature