Re: [RFC][PATCH 0/9] sched: Power scheduler design proposal

[Peter Zijlstra]

On Tue, Jul 16, 2013 at 12:57:34PM -0700, Arjan van de Ven wrote:
> then the question of how much remaining capacity; this is a hard one, and not just
> for Intel. Almost all mobile devices today are thermally constrained, ARM and Intel
> alike (at least the higher performance ones)... the curse of wanting very thin and light
> phones that are made of thermally isolating plastic (so that radio waves can go through)
> and have a nice and bright screen...

Right, so we might need to track a !idle avg over the thermal domain to
guestimate the head-room and inter-cpu relations.

But yeah, I suppose what I've been saying is that we need to drag
cpufreq into the SMP era. Only considering a single cpu isn't going to
work anymore.
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