Re: [PATCH V4 3/4] ARM: tegra: dts: cardhu: enable SLINK4
From: Laxman Dewangan
Date: Wed Oct 31 2012 - 13:41:27 EST
On Wednesday 31 October 2012 10:14 PM, Stephen Warren wrote:
On 10/31/2012 03:02 AM, Laxman Dewangan wrote:
Enable SLINK4 and connected device in Tegra30 based
platform Cardhu.
Setting maximum spi frequency to 25MHz.
Spi serial flash is connected on CS1 of SLINK4 on
cardhu platform.
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
+winbond Winbond Electronics corp.
That should really be a separate patch that goes through the devicetree
branch. But I guess it's fairly trivial, so it's not a big deal.
Yes, I thought that it should be in separate change. I did same on
earlier for ISL29028 driver and found that this small change still not
get merged. Therefore I clubbed this together as it can go without any
issue.
I believe it is fine to merge vendor-prefix from any tree.
+ spi-flash@1 {
+ compatible = "winbond,w25q32";
+ spi-max-frequency =<20000000>;
+ reg =<1>;
+ };
Since I have an Atmel flash on my board, I see:
[ 1.282958] m25p80 spi32766.1: found at25df321a, expected w25q32
[ 1.289103] m25p80 spi32766.1: at25df321a (4096 Kbytes)
Is there any way around that (the first log line above)?
I suppose the answer is that the DT should reflect the exact flash
device that's on the board, and perhaps the bootloader should be
adjusting the DT to reflect the correct value. That's probably complex.
Do you have any idea whether Atmel or Winbond flash is more common, so
we can at least minimize the number of times this message appears?
I observe that most of cardhu have the winbond. All SQA machine has
winbond. Also I believe on A04, it is winbond.
Better to go with winbond.
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