[PATCH wireless-next v2 21/31] mmc: sdio: add Morse Micro vendor ids

[Lachlan Hodges]

Add the Morse Micro mm81x series vendor ids.

Signed-off-by: Lachlan Hodges <lachlan.hodges@xxxxxxxxxxxxxx>
---

v1 -> v2:

- Use a single VENDOR_ID
- Drop B2 chip which is not needed

Ulf, a mistake was made in v1 [1] listing multiple vendor IDs instead
of a single vendor ID and the subsequent device IDs. As for why
the series is structured as a series of singular patches is due to
how wireless driver submissions are as per [2] to simplify review
due to the size. The final submission will be sent as a pull request
with all driver files as a single commit and this SDIO commit
beforehand going through the wireless tree once you have acked.

[1] https://lore.kernel.org/linux-wireless/CAPDyKFp6dhmpkMCs=ejYTpR9oNbNz0urtFD2HTvRwOp2Y7H3DA@xxxxxxxxxxxxxx/
[2] https://wireless.docs.kernel.org/en/latest/en/developers/documentation/submittingpatches.html#new-driver

---
 include/linux/mmc/sdio_ids.h | 3 +++
 1 file changed, 3 insertions(+)

diff --git a/include/linux/mmc/sdio_ids.h b/include/linux/mmc/sdio_ids.h
index 0685dd717e85..111cb1758830 100644
--- a/include/linux/mmc/sdio_ids.h
+++ b/include/linux/mmc/sdio_ids.h
@@ -117,6 +117,9 @@
 #define SDIO_VENDOR_ID_MICROCHIP_WILC		0x0296
 #define SDIO_DEVICE_ID_MICROCHIP_WILC1000	0x5347
 
+#define SDIO_VENDOR_ID_MORSEMICRO		0x325b
+#define SDIO_DEVICE_ID_MORSEMICRO_MM81XB2	0x0809
+
 #define SDIO_VENDOR_ID_NXP			0x0471
 #define SDIO_DEVICE_ID_NXP_IW61X		0x0205
 
-- 
2.43.0